RFQ

• Assembly RFQ
• Foundry RFQ

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Package Type -- Choose -- BGA HSBGA PLCC CLCC QFN QFP fcBGA LGA Ceramic package Other

If other, please specify:

Wire Type -- Choose -- Au Al Other

If other, please specify:

Wire Thickness -- Choose -- 0.8 mils 1.0 mils 1.2 mils Other

If other, please specify:

Pin/Ball Count Targeted Package Body Size BPO Size BPP Size QTY Required to be Assembled BG Required? -- Choose -- Yes No Company Name Email Address Contact Number

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Tech Node -- Choose -- 0.18um 0.13um 0.11um 90nm 65nm 40nm 28nm Other

If other, please specify:

Tapeout Type -- Choose -- MPW MLM Single reticle Other

If other, please specify:

MEM Option -- Choose -- eFlash ROM MaskROM EEPROM Other

If other, please specify:

Die QTY Required Foundry Other Process Option Company Name Email Address Contact Number

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