- Wafer fabrication
- IC Testing and packaging services. Provide wafer probe and final test. Wide range of package types such as QFP, QFN, SOP, P-DIP, PLCC, BGA, Ceramic LCC, Ceramic DIP, MicroSD, WLCSP, multi-stacked dies packages..etc
- Silicon IP sourcing; development and licensing
- Equipments sourcing
- Concept to ASIC production consultation
- Provide customers with pre-manufacturing services, such as layout design preparation, physical verification
of layout design.
- Verification IP development and licensing