Our Services

  • Foundry sourcing
  • Foundry MPW shuttle
  • Foundry operation and wafer fabrication
  • IC Testing and packaging services. Provide wafer probe and final test. Wide range of package types such as QFP, QFN, SOP, P-DIP, PLCC, BGA, Ceramic LCC, Ceramic DIP, MicroSD, WLCSP, multi-stacked dies packages..etc
  • Silicon IP sourcing; development and licensing
  • Equipments sourcing
  • Concept to ASIC production consultation
  • Provide customers with pre-manufacturing services, such as layout design preparation, physical verification of layout design.